604 search results - page 2 / 121 » Failure Mechanisms in MEMS |
ITC
2003
IEEE
13 years 10 months ago
2003
IEEE
Many of the tools and techniques used to evaluate and characterize ICs can be applied to MEMS technology. In this paper we discuss various tools and techniques used to provide str...
CORR
2007
Springer
13 years 5 months ago
2007
Springer
The expending development of wireless communication requires strong demands for components with improved capabilities. RF MEMS devices offer a variable alternative to conventional...
MASCOTS
2004
13 years 7 months ago
2004
MEMS-based storage is a new, non-volatile storage technology currently under development. It promises fast data access, high throughput, high storage density, small physical size,...
ITC
2003
IEEE
13 years 10 months ago
2003
IEEE
Electrical testing of MicroElectroMechanical Systems (MEMS) can take on many different forms including wafer probing, electrical trimming, final test at temperatures, engineering ...
CORR
2008
Springer
13 years 5 months ago
2008
Springer
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...