192 search results - page 1 / 39 » Fair Package Assignment |
AMMA
2009
Springer
13 years 11 months ago
2009
Springer
We consider the problem of fair allocation in the package assignment model, where a set of indivisible items, held by single seller, must be efficiently allocated to agents with q...
ICALP
2009
Springer
13 years 11 months ago
2009
Springer
Refereed conferences require every submission to be reviewed by members of a program committee (PC) in charge of selecting the conference program. There are many software packages...
ASPDAC
2008
ACM
13 years 6 months ago
2008
ACM
Ball Grid Array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in...
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...