192 search results - page 1 / 39 » Fair Package Assignment |
AMMA
2009
Springer
13 years 12 months ago
2009
Springer
We consider the problem of fair allocation in the package assignment model, where a set of indivisible items, held by single seller, must be efficiently allocated to agents with q...
ICALP
2009
Springer
14 years 3 days ago
2009
Springer
Refereed conferences require every submission to be reviewed by members of a program committee (PC) in charge of selecting the conference program. There are many software packages...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
Ball Grid Array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in...
ICCAD
2009
IEEE
13 years 3 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
DATE
2009
IEEE
14 years 2 days ago
2009
IEEE
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...