2 search results - page 1 / 1 » Fixed-outline thermal-aware 3D floorplanning |
ASPDAC
2010
ACM
13 years 2 months ago
2010
ACM
In this paper, we present a novel algorithm for 3D floorplanning with fixed outline constraints and a particular emphasis on thermal awareness. A computationally efficient thermal ...
TPDS
2010
13 years 3 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...