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    » Generalized Loewy-decomposition of d-modules
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    GLVLSI
    2005
    IEEE
    120views VLSI» more  GLVLSI 2005»
    3D module placement for congestion and power noise reduction
    13 years 11 months ago
    3D module placement for congestion and power noise reduction
    Download  www.gtcad.gatech.edu
    3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
    Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh
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    ACMSE
    2007
    ACM
    129views Theoretical Computer Science» more  ACMSE 2007»
    Verifying design modularity, hierarchy, and interaction locality using data clustering techniques
    13 years 10 months ago
    Verifying design modularity, hierarchy, and interaction locality using data clustering techniques
    Download  cpsc.ualr.edu
    Modularity, hierarchy, and interaction locality are general approaches to reducing the complexity of any large system. A widely used principle in achieving these goals in designin...
    Liguo Yu, Srini Ramaswamy
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