165 search results - page 2 / 33 » Heterogeneous systems on chip and systems in package |
PDP
2011
IEEE
12 years 9 months ago
2011
IEEE
—Energy-efficiency is becoming one of the most critical issues in embedded system design. In Network-on-Chip (NoC) based heterogeneous Multiprocessor Systems, the energy consump...
ASPDAC
2009
ACM
13 years 12 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
DAC
2002
ACM
14 years 6 months ago
2002
ACM
The next generation of computer chips will continue the trend for more complexity than their predecessors. Many of them will contain different chip technologies and are termed SoC...
CODES
2004
IEEE
13 years 9 months ago
2004
IEEE
Single chip heterogeneous multiprocessors are arising to meet the computational demands of portable and handheld devices. These computing systems are not fully custom designs trad...
ASPDAC
2000
ACM
13 years 9 months ago
2000
ACM
-- System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory. The key elements of SIP technology include I/O redistribution, so...