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» Hierarchical dummy fill for process uniformity
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ASPDAC
2001
ACM
90views Hardware» more  ASPDAC 2001»
13 years 9 months ago
Hierarchical dummy fill for process uniformity
Yu Chen, Andrew B. Kahng, Gabriel Robins, Alexande...
DAC
2009
ACM
14 years 6 months ago
Provably good and practically efficient algorithms for CMP dummy fill
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
Chunyang Feng, Hai Zhou, Changhao Yan, Jun Tao, Xu...