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ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 3 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
DAC
2011
ACM
12 years 5 months ago
DRAIN: distributed recovery architecture for inaccessible nodes in multi-core chips
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
WWW
2010
ACM
14 years 17 days ago
Mind the data skew: distributed inferencing by speeddating in elastic regions
Semantic Web data exhibits very skewed frequency distributions among terms. Efficient large-scale distributed reasoning methods should maintain load-balance in the face of such hi...
Spyros Kotoulas, Eyal Oren, Frank van Harmelen
CCGRID
2006
IEEE
13 years 11 months ago
Effective Load Balancing in P2P Systems
— In DHT based P2P systems, various issues such as peer heterogeneity, network topology, and diverse file popularity, may affect the DHT system efficiency. In this paper, we pr...
Zhiyong Xu, Laxmi N. Bhuyan