Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
Semantic Web data exhibits very skewed frequency distributions among terms. Efficient large-scale distributed reasoning methods should maintain load-balance in the face of such hi...
— In DHT based P2P systems, various issues such as peer heterogeneity, network topology, and diverse file popularity, may affect the DHT system efficiency. In this paper, we pr...