15 search results - page 3 / 3 » Impact of Self-Heating in Wire Interconnection on Timing |
FPL
2005
Springer
13 years 10 months ago
2005
Springer
Future process nodes have such small feature sizes that there will be an increase in the number of manufacturing defects per die. For large FPGAs, it will be critical to tolerate ...
INTEGRATION
2008
13 years 4 months ago
2008
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...
DATE
2006
IEEE
13 years 11 months ago
2006
IEEE
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
GLVLSI
2006
IEEE
13 years 11 months ago
2006
IEEE
Process variations have become a key concern of circuit designers because of their significant, yet hard to predict impact on performance and signal integrity of VLSI circuits. St...
DAC
2002
ACM
14 years 5 months ago
2002
ACM
The next generation of computer chips will continue the trend for more complexity than their predecessors. Many of them will contain different chip technologies and are termed SoC...