248 search results - page 2 / 50 » Implementing Caches in a 3D Technology for High Performance ... |
HPCA
2009
IEEE
14 years 6 months ago
2009
IEEE
Magnetic Random Access Memory (MRAM) is considered to be a promising future memory technology due to its low leakage power, high density and fast read speed. The heterogeneous int...
HPCA
2009
IEEE
14 years 6 months ago
2009
IEEE
Cache hierarchies in future many-core processors are expected to grow in size and contribute a large fraction of overall processor power and performance. In this paper, we postula...
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ISCAS
2005
IEEE
13 years 11 months ago
2005
IEEE
—Real-time spatio-temporal VLSI 3D IIR digital filters may be used for imaging or beamforming applications employing 3D input signals from synchronously-sampled multi-sensor arra...
SBACPAD
2007
IEEE
13 years 12 months ago
2007
IEEE
Multi-dimensional imaging techniques involve the processing of high resolution images commonly used in medical, civil and remote-sensing applications. A barrier commonly encounter...