3 search results - page 1 / 1 » Integration, cooling and packaging issues for aerospace equi... |
DATE
2010
IEEE
13 years 10 months ago
2010
IEEE
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
GLVLSI
2003
IEEE
13 years 10 months ago
2003
IEEE
Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stres...
DAC
2010
ACM
13 years 8 months ago
2010
ACM
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various applications from both area and performance perspectives. While the general trend in processor...