5 search results - page 1 / 1 » Interchangeable pin routing with application to package layo... |
ICCAD
1996
IEEE
13 years 9 months ago
1996
IEEE
Many practical routing problems such as BGA, PGA, pin redistribution and test xture routing involve routing with interchangeable pins. These routing problems, especiallypackage la...
DATE
2004
IEEE
13 years 8 months ago
2004
IEEE
In this paper, we study the net and pin distribution problem for global routing targeting three dimensional packaging layout via System-on-Package (SOP). The routing environment f...
ALENEX
2001
13 years 6 months ago
2001
Abstract. We present a generic package for resource constrained network optimization problems. We illustrate the flexibility and the use of our package by solving four applications...
DAC
1999
ACM
14 years 5 months ago
1999
ACM
We propose a new VLSI layout methodology which addresses the main problems faced in Deep Sub-Micron (DSM) integrated circuit design. Our layout "fabric" scheme eliminate...
ASPDAC
2004
ACM
13 years 10 months ago
2004
ACM
—The routing environment for the new emerging mixed-signal System-on-Package (SOP) technology is more advanced than that of the conventional PCB or MCM technology – pins are lo...