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9

DATE
2004
IEEE

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Net and Pin Distribution for 3D Package Global Routing

13 years 8 months ago

Net and Pin Distribution for 3D Package Global Routing

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In this paper, we study the net and pin distribution problem for global routing targeting three dimensional packaging layout via System-on-Package (SOP). The routing environment for the new emerging mixed-signal SOP technology is more advanced than that of the conventional PCB or MCM technology

Jacob R. Minz, Mohit Pathak, Sung Kyu Lim

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DATE 2004 | Hardware | Mixed-signal Sop Technology | Pin Distribution | SOP Packaging Substrate |

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Added	20 Aug 2010
Updated	20 Aug 2010
Type	Conference
Year	2004
Where	DATE
Authors	Jacob R. Minz, Mohit Pathak, Sung Kyu Lim

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