162 search results - page 1 / 33 » Interconnect Analysis: From 3-D Structures to Circuit Models |
DAC
1999
ACM
13 years 9 months ago
1999
ACM
In this survey paper we describethe combination of: discretized integral formulations, sparsication techniques, and krylov-subspace based model-order reduction that has led to rob...
DAC
1998
ACM
14 years 5 months ago
1998
ACM
As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...