3 search results - page 1 / 1 » Interconnect Challenges in Highly Integrated MEMS ASIC Subsy... |
CORR
2008
Springer
13 years 4 months ago
2008
Springer
Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to buil...
ICCAD
2004
IEEE
14 years 1 months ago
2004
IEEE
Abstract— High-level synthesis (HLS) of memory-intensive applications has featured several innovations in terms of enhancements made to the basic memory organization and data lay...
FPL
2009
Springer
13 years 9 months ago
2009
Springer
In this paper we present a verification platform designed for HyperTransport 3.x (HT3) applications. HyperTransport 3.x is a very low latency and high bandwidth chip-tochip interc...