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SLIP
2009
ACM
13 years 11 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
AVI
2010
13 years 6 months ago
An architecture and a visual interface for tagging the 3D web
Content classification performed by end users is spreading through the web. Most of the work done so far is related to the hypermedia web. In spite of that, there is a growing mas...
Fabio Pittarello
ICCS
2005
Springer
13 years 10 months ago
Simulation and Visualization of Air Flow Around Bat Wings During Flight
This paper presents a case study of interdisciplinary collaboration in building a set of tools to simulate and visualize airflow around bat wings during flight. A motion capture sy...
Igor Pivkin, Eduardo Hueso, R. Weinstein, David H....
ICRA
2010
IEEE
220views Robotics» more  ICRA 2010»
13 years 3 months ago
Autonomous Underwater Vehicle trajectory design coupled with predictive ocean models: A case study
— Data collection using Autonomous Underwater Vehicles (AUVs) is increasing in importance within the oceanographic research community. Contrary to traditional moored or static pl...
Ryan N. Smith, Arvind Pereira, Yi Chao, Peggy Li, ...