108 search results - page 3 / 22 » Introspective 3D chips |
ISCA
2006
IEEE
13 years 11 months ago
2006
IEEE
Long interconnects are becoming an increasingly important problem from both power and performance perspectives. This motivates designers to adopt on-chip network-based communicati...
TCAD
2002
13 years 5 months ago
2002
Abstract--Recent study shows that the nonuniform thermal distribution not only has an impact on the substrate but also interconnects. Hence, three
ASPDAC
2009
ACM
13 years 3 months ago
2009
ACM
We have developed a new 3-dimensional stacking technology using wafer-to-wafer stacked method and evaluated the connectivity between TSV and micro-bump. The prototype 3-layer stac...
ICCAD
2008
IEEE
14 years 2 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
ASPLOS
2006
ACM
13 years 11 months ago
2006
ACM
