Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is affected by both the power consumption of processor components and the chip layout....
This paper explores the multi-dimensional design space for chip multiprocessors, exploring the inter-related variables of core count, pipeline depth, superscalar width, L2 cache s...
Yingmin Li, Benjamin C. Lee, David Brooks, Zhigang...
Simultaneous multithreading (SMT) and chip multiprocessing (CMP) both allow a chip to achieve greater throughput, but their relative energy-efficiency and thermal properties are s...
Yingmin Li, David Brooks, Zhigang Hu, Kevin Skadro...
Simultaneous Multi-Threading (SMT) processors are becoming popular because they exploit both instruction-level and threadlevel parallelism by issuing instructions from different t...
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...