8 search results - page 1 / 2 » Joint exploration of architectural and physical design space... |
ISLPED
2005
ACM
13 years 10 months ago
2005
ACM
Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is affected by both the power consumption of processor components and the chip layout....
HPCA
2006
IEEE
14 years 5 months ago
2006
IEEE
This paper explores the multi-dimensional design space for chip multiprocessors, exploring the inter-related variables of core count, pipeline depth, superscalar width, L2 cache s...
HPCA
2005
IEEE
14 years 5 months ago
2005
IEEE
Simultaneous multithreading (SMT) and chip multiprocessing (CMP) both allow a chip to achieve greater throughput, but their relative energy-efficiency and thermal properties are s...
VLSID
2008
IEEE
14 years 5 months ago
2008
IEEE
Simultaneous Multi-Threading (SMT) processors are becoming popular because they exploit both instruction-level and threadlevel parallelism by issuing instructions from different t...
ICCD
2007
IEEE
14 years 1 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...