116 search results - page 4 / 24 » Leakage temperature dependency modeling in system level anal... |
ISQED
2006
IEEE
14 years 1 hour ago
2006
IEEE
The increase in packing density has led to a higher power density in the chip which in turn has led to an increase in temperature on the chip. Temperature affects reliability, per...
DAC
2005
ACM
14 years 7 months ago
2005
ACM
In the design of highly complex, heterogeneous, and concurrent systems, deadlock detection and resolution remains an important issue. In this paper, we systematically analyze the ...
DAC
2008
ACM
14 years 7 months ago
2008
ACM
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new model of a thermally-managed system, where a stoch...
ICCAD
2009
IEEE
13 years 3 months ago
2009
IEEE
Economic incentives have driven the semiconductor industry to separate design from fabrication in recent years. This trend leads to potential vulnerabilities from untrusted circui...
ARCS
2006
Springer
13 years 9 months ago
2006
Springer
Abstract. In order to support the dependability analysis of a system under design in an early phase of the design process, so-called fault tolerance libraries can be created that c...