11 search results - page 1 / 3 » Low-overhead circuit synthesis for temperature adaptation us... |
DATE
2007
IEEE
13 years 11 months ago
2007
IEEE
—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
ASPDAC
2006
ACM
13 years 8 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
VLSID
2003
IEEE
14 years 5 months ago
2003
IEEE
In this paper, we describe two new algorithms for datapath scheduling which aim at energy reduction while maintaining performance. The proposed algorithms, time constrained and re...
DATE
2006
IEEE
13 years 10 months ago
2006
IEEE
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
This paper presents a variation resilient circuit design technique for maintaining parametric yield of design under inherent variation in process parameters. We propose to utilize...