Sciweavers

32 search results - page 7 / 7
» Maximum Free Circuit Routing in Circuit-Switched Networks
Sort
View
SLIP
2009
ACM
13 years 11 months ago
Integrated interlayer via planning and pin assignment for 3D ICs
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
Xu He, Sheqin Dong, Xianlong Hong, Satoshi Goto
3DIC
2009
IEEE
263views Hardware» more  3DIC 2009»
13 years 8 months ago
3D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC)
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
Yaoyao Ye, Lian Duan, Jiang Xu, Jin Ouyang, Mo Kwa...