13 search results - page 1 / 3 » Methodology from chaos in IC implementation |
ISQED
2010
IEEE
13 years 11 months ago
2010
IEEE
— Algorithms and tools used for IC implementation do not show deterministic and predictable behaviors with input parameter changes. Due to suboptimality and inaccuracy of underly...
EURODAC
1994
IEEE
13 years 9 months ago
1994
IEEE
payload. The current recommendations include SDH as the physical layer transmission standard. It is defined the BISDN user network interface (UNI) SDH-based at 155.52 Mbit/s, but t...
IC
2004
13 years 6 months ago
2004
The emergence of Web Service has led to more research into Web Services composition. It has received much interest to support business-to-business or enterprise application integra...
ISQED
2002
IEEE
13 years 9 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
ASPDAC
2011
ACM
12 years 8 months ago
2011
ACM
- In low temperature polycrystalline silicon (LTPS) based display technologies, the electrical parameter variations in thin film transistors (TFTs) caused by random grain boundarie...