As a result of aggressive technology scaling, gate leakage (gate oxide direct tunneling) has become a major component of total power dissipation. Use of dielectrics of higher perm...
Saraju P. Mohanty, Ramakrishna Velagapudi, Elias K...
For CMOS technologies below 65nm, gate oxide direct tunneling current is a major component of the total power dissipation. This paper presents a simulated annealing based algorith...
Saraju P. Mohanty, Ramakrishna Velagapudi, Elias K...
— Direct tunneling current is the major component of static power dissipation of a CMOS circuit for technology below 65nm, where the gate dielectric (SiO2) is very low. We intuit...
Saraju P. Mohanty, Ramakrishna Velagapudi, Valmiki...
— Reducing the ever-growing leakage power is critical to power efficient designs. Leakage reduction techniques such as power-gating using sleep transistor insertion introduces la...
Fei Li, Lei He, Joseph M. Basile, Rakesh J. Patel,...
Reducing power dissipation is one of the most principle subjects in VLSI design today. Scaling causes subthreshold leakage currents to become a large component of total power diss...
Mohab Anis, Mohamed Mahmoud, Mohamed I. Elmasry, S...