In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
In very deep-submicron VLSI, certain manufacturing steps – notably optical exposure, resist development and etch, chemical vapor deposition and chemical-mechanical polishing (CM...
Andrew B. Kahng, Gabriel Robins, Anish Singh, Huij...
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
Chunyang Feng, Hai Zhou, Changhao Yan, Jun Tao, Xu...
Control of variability and performance in the back end of the VLSI manufacturing line has become extremely difficult with the introduction of new materials such as copper and low...
Yu Chen, Andrew B. Kahng, Gabriel Robins, Alexande...
The point set is a flexible surface representation suitable for both geometry processing and real-time rendering. In most applications, the control of the point cloud density is c...