1768 search results - page 354 / 354 » Optimal routing in Chord |
DAC
2011
ACM
12 years 5 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
EUROPAR
2004
Springer
13 years 10 months ago
2004
Springer
The interesting properties of P2P systems (high availability despite peer volatility, support for heterogeneous architectures, high scalability, etc.) make them attractive for dist...
ICCAD
2003
IEEE
13 years 10 months ago
2003
IEEE
This paper presents several important enhancements to the recently published multilevel placement package mPL [12]. The improvements include (i) unconstrained quadratic relaxation...