Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
The interesting properties of P2P systems (high availability despite peer volatility, support for heterogeneous architectures, high scalability, etc.) make them attractive for dist...
This paper presents several important enhancements to the recently published multilevel placement package mPL [12]. The improvements include (i) unconstrained quadratic relaxation...
Tony F. Chan, Jason Cong, Tim Kong, Joseph R. Shin...