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DAC
2011
ACM
12 years 10 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
EUROPAR
2004
Springer
14 years 4 months ago
Large-Scale Deployment in P2P Experiments Using the JXTA Distributed Framework
The interesting properties of P2P systems (high availability despite peer volatility, support for heterogeneous architectures, high scalability, etc.) make them attractive for dist...
Gabriel Antoniu, Luc Bougé, Mathieu Jan, S&...
ICCAD
2003
IEEE
141views Hardware» more  ICCAD 2003»
14 years 4 months ago
An Enhanced Multilevel Algorithm for Circuit Placement
This paper presents several important enhancements to the recently published multilevel placement package mPL [12]. The improvements include (i) unconstrained quadratic relaxation...
Tony F. Chan, Jason Cong, Tim Kong, Joseph R. Shin...