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» Pattern sensitive placement for manufacturability
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ISPD
2007
ACM
151views Hardware» more  ISPD 2007»
13 years 6 months ago
Pattern sensitive placement for manufacturability
When VLSI technology scales toward 45nm, the lithography wavelength stays at 193nm. This large gap results in strong refractive effects in lithography. Consequently, it is a huge...
Shiyan Hu, Jiang Hu
TVLSI
2010
12 years 11 months ago
Pattern Sensitive Placement Perturbation for Manufacturability
The gap between VLSI technology and fabrication technology leads to strong refractive effects in lithography. Consequently, it is a huge challenge to reliably print layout features...
Shiyan Hu, Patrik Shah, Jiang Hu
DAC
2000
ACM
13 years 9 months ago
Model-based dummy feature placement for oxide chemical-mechanical polishing manufacturability
—Chemical–mechanical polishing (CMP) is an enabling technique used in deep-submicrometer VLSI manufacturing to achieve long range oxide planarization. Post-CMP oxide topography...
Ruiqi Tian, D. F. Wong, Robert Boone
ICCAD
2009
IEEE
151views Hardware» more  ICCAD 2009»
13 years 2 months ago
Timing yield-aware color reassignment and detailed placement perturbation for double patterning lithography
Double patterning lithography (DPL) is a likely resolution enhancement technique for IC production in 32nm and below technology nodes. However, DPL gives rise to two independent, ...
Mohit Gupta, Kwangok Jeong, Andrew B. Kahng
AEI
2007
91views more  AEI 2007»
13 years 5 months ago
MICF: An effective sanitization algorithm for hiding sensitive patterns on data mining
Data mining mechanisms have widely been applied in various businesses and manufacturing companies across many industry sectors. Sharing data or sharing mined rules has become a tr...
Yu-Chiang Li, Jieh-Shan Yeh, Chin-Chen Chang