20 search results - page 2 / 4 » Performance-Driven Global Routing for Cell Based ICs |
IPPS
1997
IEEE
13 years 9 months ago
1997
IEEE
In this paper, we propose three different parallel algorithms based on a state-of-the-art global router called TimberWolfSC. The parallel algorithms have been implemented by using...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Because of the increasing dominance of interconnect issues in advanced IC technology, placement has become a critical step in the IC design flow. To get accurate interconnect inf...
ICCAD
2005
IEEE
14 years 1 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
TCAD
2002
13 years 4 months ago
2002
In this paper, we propose a new approach for VLSI interconnect global routing that can optimize both congestion and delay, which are often competing objectives. Our approach provi...
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
The flip-chip package is introduced for modern IC designs with higher integration density and larger I/O counts. In this paper, we consider the pre-assignment flip-chip routing pr...