1419 search results - page 2 / 284 » Power Droop Testing |
TCAD
2011
13 years 7 days ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
TVLSI
2010
12 years 12 months ago
2010
DATE
2008
IEEE
13 years 11 months ago
2008
IEEE
VLSID
2004
IEEE
14 years 5 months ago
2004
IEEE
ICASSP
2011
IEEE
12 years 9 months ago
2011
IEEE
Power management in loudspeakers is used to extend the battery life of portable electronics and to prevent thermal damage to the speakers. Traditionally, speaker power management ...