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» Power distribution paths in 3-D ICS
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HPCA
2009
IEEE
14 years 5 months ago
A low-radix and low-diameter 3D interconnection network design
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...
ASPDAC
2008
ACM
107views Hardware» more  ASPDAC 2008»
13 years 7 months ago
Full-chip thermal analysis for the early design stage via generalized integral transforms
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...
Pei-Yu Huang, Chih-Kang Lin, Yu-Min Lee
DATE
2006
IEEE
126views Hardware» more  DATE 2006»
13 years 11 months ago
Analysis and modeling of power grid transmission lines
Power distribution and signal transmission are becoming key limiters for chip performance in nanometer era. These issues can be simultaneously addressed by designing transmission ...
J. Balachandran, Steven Brebels, G. Carchon, T. We...
ICS
2011
Tsinghua U.
12 years 8 months ago
Scalable fine-grained call path tracing
Applications must scale well to make efficient use of even medium-scale parallel systems. Because scaling problems are often difficult to diagnose, there is a critical need for sc...
Nathan R. Tallent, John M. Mellor-Crummey, Michael...
ICS
2010
Tsinghua U.
13 years 10 months ago
Small-ruleset regular expression matching on GPGPUs: quantitative performance analysis and optimization
We explore the intersection between an emerging class of architectures and a prominent workload: GPGPUs (General-Purpose Graphics Processing Units) and regular expression matching...
Jamin Naghmouchi, Daniele Paolo Scarpazza, Mladen ...