9 search results - page 2 / 2 » Practical iterated fill synthesis for CMP uniformity |
DATE
2003
IEEE
13 years 10 months ago
2003
IEEE
Control of variability and performance in the back end of the VLSI manufacturing line has become extremely difficult with the introduction of new materials such as copper and low...
ISPD
2010
ACM
13 years 11 months ago
2010
ACM
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
VLSID
1999
IEEE
13 years 9 months ago
1999
IEEE
To reduce manufacturing variation due to chemicalmechanical polishing and to improve yield, layout must be made uniform with respect to density criteria. This is achieved by layou...
ISPD
1998
ACM
13 years 9 months ago
1998
ACM
In very deep-submicron VLSI, certain manufacturing steps – notably optical exposure, resist development and etch, chemical vapor deposition and chemical-mechanical polishing (CM...