—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...