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ASPDAC
2007
ACM
122views Hardware» more  ASPDAC 2007»
10 years 3 months ago
Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...
Arthur Nieuwoudt, Mosin Mondal, Yehia Massoud
ISVLSI
2007
IEEE
116views VLSI» more  ISVLSI 2007»
10 years 6 months ago
Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alter...
Soumya Eachempati, Narayanan Vijaykrishnan, Arthur...
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