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ISVLSI
2007
IEEE

Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures

10 years 5 months ago
Impact of Process Variations on Carbon Nanotube Bundle Interconnect for Future FPGA Architectures
As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alternative interconnect solutions for future process technologies. In this paper, we investigate the impact of statistical variations in interconnect properties on FPGA timing yield (TY) when single-walled carbon nanotube (SWCNT) bundle based interconnect is used in the FPGA routing fabric and the results indicate that SWCNT bundle-based interconnect (SWCNTBI) can provide a superior performance-yield trade-off over FPGAs implemented using traditional CuI in future process technologies.
Soumya Eachempati, Narayanan Vijaykrishnan, Arthur
Added 04 Jun 2010
Updated 04 Jun 2010
Type Conference
Year 2007
Where ISVLSI
Authors Soumya Eachempati, Narayanan Vijaykrishnan, Arthur Nieuwoudt, Yehia Massoud
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