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VRML
2003
ACM
13 years 10 months ago
2003
ACM
Success of 3D applications on the Web inherently depends on object behavior and interaction. Current Web3D formats often fall short in supporting behavior modeling. This paper int...
DAC
2010
ACM
13 years 9 months ago
2010
ACM
The emerging three-dimensional integrated circuit (3D IC) is beneficial for various applications from both area and performance perspectives. While the general trend in processor...
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
MICRO
2009
IEEE
13 years 11 months ago
2009
IEEE
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...
NOCS
2009
IEEE
13 years 11 months ago
2009
IEEE
Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...