13 search results - page 1 / 3 » Recent Research and Emerging Challenges in Physical Design f... |
ASPDAC
2007
ACM
13 years 8 months ago
2007
ACM
As IC process geometries scale down to the nanometer territory, the industry faces severe challenges of manufacturing limitations. To guarantee yield and reliability, physical des...
DAC
2010
ACM
13 years 8 months ago
2010
ACM
Post-silicon validation is used to detect and fix bugs in integrated circuits and systems after manufacture. Due to sheer design complexity, it is nearly impossible to detect and ...
ASPDAC
2012
ACM
12 years 17 days ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
GLVLSI
2009
IEEE
13 years 8 months ago
2009
IEEE
The rapidly expanding diversity of technology available at the nanoscale is disrupting the existing transistorcentric microelectronics design paradigm, resulting in nearly decade-l...
ASPDAC
2005
ACM
13 years 10 months ago
2005
ACM
The progressive trend of fabrication technologies towards the nanometer regime has created a number of new physical design challenges for computer architects. Design complexity, u...