On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
Daniele Rossi, Steven V. E. S. van Dijk, Richard P...
In this paper, we propose joint repeater insertion and crosstalk avoidance coding as a low-power alternative to repeater insertion for global bus design in nanometer technologies....
A heuristic algorithm for a given topology of a multiple-source and multiple-sink bus to reduce the signal delay time is proposed. The algorithm minimizes the delay by inserting bu...
Abstract— Deep submicron technology scaling has two major ramifications on the design process. First, reduced feature size significantly increases wire delay, thus resulting in...
As process technology migrates to deep submicron with feature size less than 100nm, global wire delay is becoming a major hindrance in keeping the latency of intra-chip communicat...
Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watew...