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» Reducing bus delay in submicron technology using coding
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IOLTS
2003
IEEE
133views Hardware» more  IOLTS 2003»
13 years 10 months ago
Power Consumption of Fault Tolerant Codes: the Active Elements
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
Daniele Rossi, Steven V. E. S. van Dijk, Richard P...
ISLPED
2005
ACM
99views Hardware» more  ISLPED 2005»
13 years 11 months ago
A low-power bus design using joint repeater insertion and coding
In this paper, we propose joint repeater insertion and crosstalk avoidance coding as a low-power alternative to repeater insertion for global bus design in nanometer technologies....
Srinivasa R. Sridhara, Naresh R. Shanbhag
ASPDAC
1995
ACM
106views Hardware» more  ASPDAC 1995»
13 years 9 months ago
Performance driven multiple-source bus synthesis using buffer insertion
A heuristic algorithm for a given topology of a multiple-source and multiple-sink bus to reduce the signal delay time is proposed. The algorithm minimizes the delay by inserting bu...
Chia-Chun Tsai, De-Yu Kao, Chung-Kuan Cheng, Ting-...
ICCAD
2000
IEEE
109views Hardware» more  ICCAD 2000»
13 years 9 months ago
Latency-Guided On-Chip Bus Network Design
Abstract— Deep submicron technology scaling has two major ramifications on the design process. First, reduced feature size significantly increases wire delay, thus resulting in...
Milenko Drinic, Darko Kirovski, Seapahn Meguerdich...
DAC
2004
ACM
14 years 6 months ago
Profile-guided microarchitectural floorplanning for deep submicron processor design
As process technology migrates to deep submicron with feature size less than 100nm, global wire delay is becoming a major hindrance in keeping the latency of intra-chip communicat...
Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watew...