Structured ASICs have recently emerged as an exciting alternative to ASIC or FPGA design style as they provide a new trade-off between the high performance of ASIC design and low ...
With the recent advent of deep sub-micron technology and new packaging schemes such as Multi-Chip Modules(MCMs), integrated circuit components are often not rectangular. Most exis...
Carbon nanotubes (CNTs), with their unique electronic properties, are promising materials for building nanoscale circuits. In this paper, we present a new CNT-based FPGA architect...
Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effec...
The placement of on-die decoupling capacitors (decap) between the power and ground supply grids has become a common practice in high performance processor designs. In this paper, ...