2 search results - page 1 / 1 » Rethinking Threshold Voltage Assignment in 3D Multicore Desi... |
VLSID
2010
IEEE
13 years 3 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Due to high levels of integration and complexity, the design of multi-core SoCs has become increasingly challenging. In particular, energy consumption and distributing a single gl...