Sciweavers

3 search results - page 1 / 1
» Reticle Floorplanning with Guaranteed Yield for Multi-Projec...
Sort
View
ISQED
2005
IEEE
76views Hardware» more  ISQED 2005»
13 years 10 months ago
Reticle Floorplanning and Wafer Dicing for Multiple Project Wafers
Multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In this paper1 , we proposed two MILP models for simult...
Meng-Chiou Wu, Rung-Bin Lin
ASPDAC
2006
ACM
120views Hardware» more  ASPDAC 2006»
13 years 10 months ago
Design space exploration for minimizing multi-project wafer production cost
- Chip floorplan in a reticle for Multi-Project Wafer (MPW) plays a key role in deciding chip fabrication cost. In this paper1 , we propose a methodology to explore reticle floopla...
Rung-Bin Lin, Meng-Chiou Wu, Wei-Chiu Tseng, Ming-...