In nanometer regime, the effects of variations are having an increasing impact on the delay and power characteristics of devices as well as the yield of the circuit. Statistical t...
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
As the thermal wall becomes the dominant factor limiting VLSI circuit performance, and the interconnect wires become the primary power consumer, power efficiency of onchip data th...
Renshen Wang, Evangeline F. Y. Young, Ronald L. Gr...
Continuing VLSI technology scaling raises several deep submicron (DSM) problems like relatively slow interconnect, power dissipation and distribution, and signal integrity. Those ...
Abstract— As VLSI technology enters the nanoscale regime, interconnect delay becomes the bottleneck of circuit performance. Compared to gate delays, wires are becoming increasing...