In this paper, we present a congestion-driven placement flow. First, we consider in the global placement stage the routing demand to re-place cells in order to avoid congested re...
Chen Li 0004, Min Xie, Cheng-Kok Koh, Jason Cong, ...
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...