5 search results - page 1 / 1 » Scan chain design for three-dimensional integrated circuits ... |
ICCD
2007
IEEE
14 years 1 months ago
2007
IEEE
Scan chains are widely used to improve the testability of IC designs. In traditional 2D IC designs, various design techniques on the construction of scan chains have been proposed...
ISQED
2002
IEEE
13 years 9 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
ICCD
2005
IEEE
14 years 1 months ago
2005
IEEE
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
ICCAD
2004
IEEE
14 years 1 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
DAC
2007
ACM
13 years 8 months ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...