Sciweavers

Share
DAC
2007
ACM

CAD Implications of New Interconnect Technologies

8 years 7 months ago
CAD Implications of New Interconnect Technologies
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a replacement for metal interconnects, and optical interconnections for longer range on-chip communication. Each of these requires new CAD support to be used effectively. Categories and Subject Descriptors B.7.1 [Integrated Circuits]: Types and Design Styles-Advanced technologies, VLSI ; B.7.2 [Integrated Circuits]: Design Aids--Placement and routing General Terms Algorithms, Design, Performance Keywords 3D interconnect, Nanotubes, On-chip optical
Louis Scheffer
Added 14 Aug 2010
Updated 14 Aug 2010
Type Conference
Year 2007
Where DAC
Authors Louis Scheffer
Comments (0)
books