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» Silicon Single-Electron Devices and Their Applications
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ISCA
2009
IEEE
161views Hardware» more  ISCA 2009»
13 years 12 months ago
AnySP: anytime anywhere anyway signal processing
In the past decade, the proliferation of mobile devices has increased at a spectacular rate. There are now more than 3.3 billion active cell phones in the world—a device that we...
Mark Woh, Sangwon Seo, Scott A. Mahlke, Trevor N. ...
FCCM
1998
IEEE
149views VLSI» more  FCCM 1998»
13 years 9 months ago
Configuration Compression for the Xilinx XC6200 FPGA
One of the major overheads in reconfigurable computing is the time it takes to reconfigure the devices in the system. This overhead limits the speedups possible in this exciting n...
Scott Hauck, Zhiyuan Li, Eric J. Schwabe
RTSS
2006
IEEE
13 years 11 months ago
Run-Time Services for Hybrid CPU/FPGA Systems on Chip
Modern FPGA devices, which include (multiple) processor core(s) as diffused IP on the silicon die, provide an excellent platform for developing custom multiprocessor systems-on-pr...
Jason Agron, Wesley Peck, Erik Anderson, David L. ...
DSD
2010
IEEE
190views Hardware» more  DSD 2010»
13 years 5 months ago
Hardware-Based Speed Up of Face Recognition Towards Real-Time Performance
— Real-time face recognition by computer systems is required in many commercial and security applications because it is the only way to protect privacy and security in the sea of...
I. Sajid, Sotirios G. Ziavras, M. M. Ahmed
CORR
2008
Springer
148views Education» more  CORR 2008»
13 years 5 months ago
Copper Electrodeposition for 3D Integration
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
Rozalia Beica, Charles Sharbono, Tom Ritzdorf