13 search results - page 2 / 3 » Simulation and modeling of the effect of substrate conductiv... |
3DIC
2009
IEEE
14 years 10 days ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
ICCD
2007
IEEE
14 years 2 months ago
2007
IEEE
Physical layout generation of RF embedded passive design is not an easy task since the response of a given layout is tightly coupled with the response of the individual components...
ISCAS
2005
IEEE
13 years 11 months ago
2005
IEEE
Inductance effects of on-chip interconnects have become more and more significant in today’s high-speed digital circuits, especially for global interconnects such as signal buse...
DAC
2002
ACM
14 years 6 months ago
2002
ACM
For present-day micro-electronic designs, it is becoming ever more important to accurately model substrate coupling effects. Basically, either a Finite Element Method (FEM) or a B...
ICCAD
2000
IEEE
13 years 10 months ago
2000
IEEE
The increasing size of integrated systems combined with deep submicron physical modeling details creates an explosion in RLC interconnect modeling complexity of unmanageable propo...