12 search results - page 3 / 3 » Simultaneous Placement and Module Optimization of Analog IC'... |
DATE
2006
IEEE
13 years 10 months ago
2006
IEEE
— In this paper, we present the first multi-objective microarchitectural floorplanning algorithm for designing highperformance, high-reliability processors in the early design ...
ICCAD
2007
IEEE
14 years 1 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...