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ICCAD
2007
IEEE
14 years 1 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
ICCAD
2007
IEEE
14 years 1 months ago
2007
IEEE
— Energy efficiency has become one of the most important issues to be addressed in today’s System-on-a-Chip (SoC) designs. One way to lower the power consumption is to reduce ...