4 search results - page 1 / 1 » Stable and compact inductance modeling of 3-D interconnect s... |
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Recent successful techniques for the efficient simulation of largescale interconnect models rely on the sparsification of the inverse of the inductance matrix L. While there are...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
ASPDAC
2005
ACM
13 years 7 months ago
2005
ACM
Abstract— The sparsification of the reluctance matrix L−1 (where L denotes the usual inductance matrix L) has been widely used in several recent investigations to make the pro...
ECCV
2010
Springer
13 years 9 months ago
2010
Springer
Abstract. Planar patches are a very compact and stable intermediate representation of 3D scenes, as they are a good starting point for a complete automatic reconstruction of surfac...