Abstract. Reduction of chip packaging and cooling costs for deep sub-micron SystemOn-Chip (SOC) designs is an emerging issue. We present a simulation-based methodology able to real...
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
In model-based testing, one of the biggest decisions taken before modelling is the modelling language and the model analysis tool to be used to model the system under investigation...
With the growing complexity in consumer embedded products, new tendencies forecast heterogeneous Multi-Processor SystemsOn-Chip (MPSoCs) consisting of complex integrated component...
David Atienza, Federico Angiolini, Srinivasan Mura...
An system-level power management technique for massively distributed wireless microsensor networks is proposed. A power aware sensor node model is introduced which enables the embe...